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Module 7

Design For Testability

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Topics Covered

INTRODUCTION TO DFT

(Design For Testability – Beginner Level)


1️⃣ Importance of Testing (WHY testing is needed?)

Why is testing mandatory in VLSI?

  • As technology node reduces (7nm, 5nm, 3nm):
  • Transistors become very small
  • Manufacturing becomes more complex
  • Even a tiny dust particle can:
  • Short two wires
  • Break a connection (open fault)

100% defect-free manufacturing is NOT possible


Why we test chips?

  • Some defects are unavoidable
  • Testing helps:
  • Identify good chips
  • Reject bad chips
  • Faulty chips must NOT reach customers

Product Quality Depends On

Parameter

Meaning

Test Cost

Cost spent on testing

Test Time

Time taken to test each chip

Test Quality

How many faults are detected

Goal:
✔ Low cost
✔ Less time
✔ High fault detection


VLSI Chip Testing Importance: Cost, Time, and Quality Parameters

2️⃣ What is DFT (Design For Testability)?

Definition (Simple Words)

DFT is the extra logic added to a chip during the design stage to make post-manufacturing testing possible.


Key Points

  • DFT is added before fabrication
  • It helps test:
  • Internal flip-flops
  • Internal nets
  • Memory elements
  • Manufacturing is not error-free
  • So testing after manufacturing is compulsory

Important Clarification

DFT does NOT repair the chip
DFT only
detects whether chip is GOOD or BAD


DFT is:

  • Detection → YES
  • Localization → NO
  • Repair → NO

Design For Testability (DFT) Logic Insertion Concept Diagram

3️⃣ Difference Between Verification and Testing

Functional Verification

  • Done before fabrication
  • Uses testbench
  • Checks design logic correctness

Testing (DFT)

  • Done after fabrication
  • Checks manufacturing defects
  • Uses test patterns

Comparison Diagram: Functional Verification vs Post-Manufacturing Testing

4️⃣ Faults, Defects, Errors (VERY IMPORTANT)

Defect

  • Physical problem in silicon
  • Example:
  • Broken wire
  • Short circuit

Fault

  • Logical model of defect
  • Example:
  • Stuck-at-0
  • Stuck-at-1

Error

  • Wrong output seen at chip pin


Defect → Fault → Error


Relationship between Physical Defects, Logical Faults, and Observed Errors

5️⃣ Fault Models (Core Concept of DFT)

Why Fault Models?

  • We cannot see inside silicon
  • So we model defects logically
  • Most common model: Stuck-At Fault

Stuck-At-1 Fault

  • Net always reads logic ‘1’
  • Even if we drive ‘0’

Stuck-At-0 Fault

  • Net always reads logic ‘0’
  • Even if we drive ‘1’

Testing a Net N2

Test

Purpose

Drive N2 = 0

Check stuck-at-1

Drive N2 = 1

Check stuck-at-0


Stuck-At Fault Model (SA0 and SA1) Logical Representation

6️⃣ Controllability & Observability

Controllability

Ability to force a node to 0 or 1

Observability

Ability to see the value of a node at output


Why DFT is needed?

  • Internal nodes are not directly visible
  • Only chip pins are visible
  • DFT provides path to control & observe

DFT Controllability and Observability Concepts in Digital Circuits

7️⃣ Fault Simulation & Fault Coverage

Fault Simulation

  • Insert faults intentionally
  • Run test patterns
  • Check if fault is detected

Fault Coverage Formula

Fault Coverage=Detected FaultsTotal Faults×100Fault\ Coverage = \frac{Detected\ Faults}{Total\ Faults} \times 100Fault Coverage=Total FaultsDetected Faults×100


Industry Expectation

  • 95% fault coverage

  • Some designs target 99%+

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8️⃣ Types of Defects in VLSI

Process Defects

  • Missing vias
  • Shorts
  • Opens

Material Defects

  • Crystal imperfections
  • Impurities

Aging Defects

  • Electromigration
  • Oxide breakdown

Package Defects

  • Broken pins
  • Seal leaks

Common Manufacturing Defects in VLSI: Process, Material, and Aging

9️⃣ Major Types of Faults

Structural Faults

  • Due to manufacturing
  • Shorts, opens

Transition Faults

  • Signal does not switch fast enough
  • Related to:
  • Setup time
  • Hold time

Structural and Transition Fault Models in Sequential Logic

🔟 Scan Design (MOST IMPORTANT DFT TOPIC)

Why Scan Design?

  • Flip-flops hide internal states
  • Scan converts flip-flops into shift register

Scan Chain Components

Signal

Purpose

Scan In (SI)

Shift data in

Scan Out (SO)

Shift data out

Scan Enable (SE)

Select test/functional

Clock

Shift & capture


Functional Mode

  • Normal operation
  • SE = 0

Test Mode

  • Scan enabled
  • SE = 1

Scan Design Architecture: SI, SO, SE, and Clock Signals

1️⃣1️⃣ Scan Stitching

What is Scan Stitching?

  • Connecting flip-flops serially
  • Forms scan chains

Why Scan Stitching Needed?

  • Access internal flops
  • Improve controllability & observability
  • Enable ATPG

Problems Without Reordering

  • Long wirelength
  • Congestion
  • Routing issues

Scan Chain Reordering

  • Reorder flops based on placement
  • Reduces:
  • Wirelength
  • Congestion
  • Hold issues

Scan Chain Stitching and Physical Placement Based Reordering

1️⃣2️⃣ Scan Chain Parameters

Scan Length

  • Number of flops in one chain
  • Trade-off:
  • Long chain → less IO, more time
  • Short chain → more IO, less time

Scan Polarity

  • Active high / Active low scan enable
  • Must match library cells

Scan DEF File

  • Contains scan chain info
  • Required during physical design

1️⃣3️⃣ Where DFT Fits in ASIC Flow

RTL

Synthesis

DFT Insertion

ATPG

Placement

Scan Reordering

Routing

Manufacturing

Testing


DFT Insertion Stage within the Standard ASIC Design Flow

FINAL SUMMARY

  • DFT ensures testable silicon
  • Scan design is heart of DFT
  • Fault modeling enables detection
  • Controllability + Observability are key
  • Scan stitching & reordering are critical for PD

1️⃣ ATPG – Automatic Test Pattern Generation

What is ATPG?

ATPG is a software tool that automatically generates test vectors to detect faults in a design.


Why ATPG is needed?

  • Millions of faults exist in large chips
  • Manual test writing is impossible
  • ATPG:
  • Generates patterns
  • Maximizes fault coverage
  • Minimizes test time

ATPG Uses:

  • Scan chains
  • Fault models (stuck-at, transition)
  • DFT logic

Automatic Test Pattern Generation (ATPG) Tool Operation Diagram

2️⃣ Types of Scan Design

1. Full Scan

  • All flip-flops are scan-enabled
  • Highest fault coverage
  • Most common in industry

2. Partial Scan

  • Only some flip-flops are scanned
  • Used when:
  • Area is critical
  • Performance is critical

Comparison of Full Scan and Partial Scan Design Strategies

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3️⃣ Shift Cycle vs Capture Cycle (VERY IMPORTANT)

Shift Cycle

  • Scan Enable = 1
  • Flip-flops act as shift registers
  • Data shifted in/out

Capture Cycle

  • Scan Enable = 0
  • Functional clock applied
  • Circuit response captured

Test Operation Flow

Shift → Shift → Shift → Capture → Shift out


Scan Operation Cycles: Shift Cycle vs Capture Cycle Timing Diagram

4️⃣ Scan Clock vs Functional Clock

Functional Clock

  • Used during normal operation
  • High frequency

Scan Clock

  • Used during testing
  • Low frequency (to reduce power)

Why Separate Scan Clock?

  • Avoid IR drop
  • Avoid overheating
  • Safe shifting

5️⃣ Reset in Scan Design

Why Reset is Important?

  • Initialize flip-flops
  • Avoid unknown (X) states

Types of Reset

  • Asynchronous reset
  • Synchronous reset

Reset must be scan-friendly


Reset Signal Management in Scan-Based Digital Designs

6️⃣ Multiple Scan Chains

Why Multiple Scan Chains?

  • Single chain = very long shift time
  • Multiple chains:
  • Reduce test time
  • Parallel shifting

Example

  • 100,000 flops
  • 10 scan chains → 10,000 flops per chain

Architecture of Multiple Parallel Scan Chains for Test Time Reduction

7️⃣ Scan Compression (High-Level)

Problem Without Compression

  • Too many test vectors
  • Long tester time
  • High memory usage

Scan Compression

  • Compress input patterns
  • Decompress on-chip
  • Compress output response

Huge test time reduction


Scan Compression and Decompression Architecture for Efficient Testing

8️⃣ DFT for Memory – MBIST (Intro Level)

What is MBIST?

Memory Built-In Self Test


Why MBIST?

  • Memories occupy large chip area
  • Scan cannot efficiently test memories

MBIST Tests:

  • Stuck-at faults
  • Address faults
  • Coupling faults

Memory Built-In Self Test (MBIST) Block Diagram and Controller

9️⃣ Boundary Scan (JTAG) – High Level

What is Boundary Scan?

  • Test IO pins
  • Used for:
  • Board-level testing
  • Debugging

IEEE Standard

  • IEEE 1149.1 (JTAG)

Boundary Scan (JTAG) IEEE 1149.1 Architecture and TAP Controller

🔟 DFT Design Rules (DFT Rules)

Common DFT Rules

  • No gated clocks (or scan-safe gating)
  • Avoid combinational loops
  • Reset must reach all flops
  • Avoid latches (unless intentional)
  • No X-propagation paths

Why Do Rules Matter?

  • ATPG depends on clean logic
  • Violations reduce fault coverage

1️⃣1️⃣ DFT Signals Summary

Signal

Purpose

Scan In

Shift test data in

Scan Out

Shift test data out

Scan Enable

Select test/functional

Scan Clock

Shift & capture

Reset

Initialize flops

Test Mode

Enable DFT logic


1️⃣2️⃣ Common Student Mistakes (VERY USEFUL)

DFT fixes silicon → WRONG
Scan is only for testing → PARTIAL
Fault = defect → WRONG

DFT detects, not fixes
Scan improves observability
Fault is a model, defect is physical

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